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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

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Product Description

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

<P>This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.</P>

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
ItemPartNumber
23129494
ReleaseDate
2008-09-19T00:00:01Z
UnitCount
1
EANs
9780387765327

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