3D IC Stacking Technology

3D IC Stacking Technology

<h4>The latest advances in three-dimensional integrated circuit stacking technology</h4> <p>With a focus on industrial applications, <i>3D IC Stacking Technology</i> offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.</p> <p><i>3D IC Stacking Technology</i> covers:<ul> <li>High density through silicon stacking (TSS) technology <li>Practical design ecosystem for heterogeneous 3D IC products <li>Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack <li>Process integration for TSV manufacturing <li>High-aspect-ratio silicon etch for TSV <li>Dielectric deposition for TSV <li>Barrier and seed deposition <li>Copper electrodeposition for TSV <li>Chemical mechanical polishing for TSV applications <li>Temporary and permanent bonding <li>Assembly and test aspects of TSV technology</ul></p>