3D IC Integration and Packaging

3D IC Integration and Packaging

<div><p class="MsoNormal"><span style="font-size:12.0pt;line-height:107%;font-family:"Times New Roman",serif"><b>Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  <span style="white-space:pre"></span>authenticity, or access to any online entitlements included with the product</b>.<o:p></o:p></span></p></div><b><div><b><br></b></div>A comprehensive guide to 3D IC integration and packaging technology</b><div><br></div><div><i>3D IC Integration and Packaging</i> fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.</div><div><br></div><div><i>3D IC Integration and Packaging </i>covers:</div><div><br></div><div><span style="font-family: 'Times New Roman', serif; font-size: 12pt;">• </span>3D integration for semiconductor IC packaging</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Through-silicon vias modeling and testing</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Stress sensors for thin-wafer handling and strength measurement</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Package substrate technologies</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Microbump fabrication, assembly, and reliability</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>3D Si integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>2.5D/3D IC integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>3D IC integration with passive interposer</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Thermal management of 2.5D/3D IC integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>Embedded 3D hybrid integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>3D LED and IC integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>3D MEMS and IC integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>3D CMOS image sensors and IC integration</div><div><span style="font-family: 'Times New Roman', serif; font-size: 16px;">• </span>PoP, chip-to-chip interconnects, and embedded fan-out WLP</div>