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Wafer Bonding

Wafer Bonding

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Product Description

Wafer Bonding

<P>The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.</P>

Technical Specifications

Country
USA
Binding
Hardcover
EAN
9783540210498
Edition
2004
ISBN
3540210490
Label
Springer
Manufacturer
Springer
MPN
363 black & white illustrations, 20 colo
NumberOfItems
1
NumberOfPages
499
PartNumber
363 black & white illustrations, 20 colo
PublicationDate
2004-06-24
Publisher
Springer
Studio
Springer

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