Strong-Bond 104 Electronic Industries Epoxy Adhesive, Special Formulation, 2 Part, Thixotropic
Product Description
Strong-Bond 104 Electronic Industries Epoxy Adhesive, Special Formulation, 2 Part, Thixotropic
- Appearance: Milky translucent
- Cure Type: Room temperature or Heat cure
- Benefits: Great for Aerospace applications Great for reinforcing applications Bonds to many substrates
- Mix Ratio by weight: 100:22 / Resin:Hardener
- Substrates: metals, glass, ceramics, wood and many plastics
Technical Specifications
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