GENNEL G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset IC High Performance

GENNEL G109 10gram Thermal Conductive Glue, Heatsink Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound for LED GPU MOSFET Printer Chipset IC High Performance

• Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
• Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
• It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
• Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
• Package Includes : 1 x GENNEL G109 10g thermal glue

* 100% New Heatsink plaster. <br> * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink. <br> * Features: thermal properties, strong adhesion <br> * Melting capacity: 0 (200 ℃ / 24Hours) <br> * Evaporation: 0.001% (200 ℃ / 24Hours) <br> * Thermal conductivity:> 1.2W/m-K <br> * Thermal Impedance: <0.06 <br> * Clotting time: 3min (25 ℃) <br> * Strength of connected buildings: 25Kg <br> * Insulation coefficient> 5.1 <br> * Dissipation coefficient <0.005 <br> * Temperature resistance: 200 ℃ <br> * Net Weight: 10g <br><br> Do not use thermal glue between CPU Chip and heatsink <br><br> Package Includes: <br> <b>1 x Thermal Heatsink Plaster Glue. </b>