ENGINEER Engineer Solder Suction Device SS-02

ENGINEER Engineer Solder Suction Device SS-02

• Made in Japan
• Innovative Silicone Nozzle allows closer placement to soldering iron tip (therefore better suction & better solder removal)
• Compact design allows easy one handed operation
• Withstands direct contact with soldering iron (350C Max)
• Highest quality construction & components used

This desoldering pump is at the cutting edge of solder removal technology. The flexible heat resistant silicone tip allows the the nozzle to come into direct contact with the soldering iron without damage and allows the nozzle to 'envelope' the solder joint. This dramatically improves suction and therefore less solder residue remains after each press/action. Easily disassembled for quick maintenance. The ss-02 comes with a one spare silicone tube which can be cut to yield several fresh nozzles.