Import It All
Books > Computers & Technology > Hardware & DIY > Microprocessors & System Design
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Product ID: 226771658 Condition: New

Payflex: Pay in 4 interest-free payments of R2,307.25. Learn more
R 9,229
includes Duties & VAT
Delivery: 10-20 working days
Ships from USA warehouse.
Secure Transaction
VISA Mastercard payflex ozow
Due to be released on 2026-04-15. Delivery times apply once released.

Product Description

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
ReleaseDate
2026-04-15T00:00:01Z
UnitCount
1
EANs
9789819568901

You might also like

Back to top